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レポート概要
| QYResearch社発行の本調査資料では、薄型ウェーハ仮接合装置＆材料のグローバル市場（2016年～2027年）について調べ、市場動向、主要企業の市場シェア、種類別市場規模（化学的剥離、ホットスライディング剥離、機械的剥離、レーザー剥離）、用途別市場規模（<100 µmウェーハ、40 µmウェーハ以下）、主要地域別市場規模（北米、アメリカ、ヨーロッパ、アジア、日本、中国、韓国、インド、東南アジア、中南米、中東、アフリカ等）、関連企業情報などを掲載しています。 ・市場概要 ・薄型ウェーハ仮接合装置＆材料の市場動向 ・企業の競争状況、市場シェア ・薄型ウェーハ仮接合装置＆材料の種類別市場規模（化学的剥離、ホットスライディング剥離、機械的剥離、レーザー剥離） ・薄型ウェーハ仮接合装置＆材料の用途別市場規模（<100 µmウェーハ、40 µmウェーハ以下） ・薄型ウェーハ仮接合装置＆材料の北米市場規模2016-2027（アメリカ、カナダ） ・薄型ウェーハ仮接合装置＆材料のヨーロッパ市場規模2016-2027（ドイツ、フランス、イギリス等） ・薄型ウェーハ仮接合装置＆材料のアジア市場規模2016-2027（日本、中国、韓国、インド、東南アジア等） ・薄型ウェーハ仮接合装置＆材料の中南米市場規模2016-2027（メキシコ、ブラジル） ・薄型ウェーハ仮接合装置＆材料の中東・アフリカ市場規模2016-2027（トルコ、サウジアラビア等） ・主要企業情報（3M、ABB、Accretech、AGC、AMD、Cabot、Corning、Crystal Solar、Dalsa、DoubleCheck Semiconductors、1366 Technologies、Ebara、ERS、Hamamatsu、IBM、Intel、LG Innotek、Mitsubishi Electric、Qualcomm、Robert Bosch、Samsung、Sumitomo Chemical） ・結論 |
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding. Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times.
Market Analysis and Insights: Global Thin Wafers Temporary Bonding Equipment and Materials Market
The global Thin Wafers Temporary Bonding Equipment and Materials market size is projected to reach US$ XX million by 2027, from US$ XX million in 2020, at a CAGR of XX% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Thin Wafers Temporary Bonding Equipment and Materials market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Thin Wafers Temporary Bonding Equipment and Materials market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Thin Wafers Temporary Bonding Equipment and Materials market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Thin Wafers Temporary Bonding Equipment and Materials market.
Global Thin Wafers Temporary Bonding Equipment and Materials Scope and Market Size
Thin Wafers Temporary Bonding Equipment and Materials market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Thin Wafers Temporary Bonding Equipment and Materials market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.
Segment by Type
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding
Segment by Application
< 100 µm Wafers
below 40µm Wafers
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
By Company
3M
ABB
Accretech
AGC
AMD
Cabot
Corning
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm
Robert Bosch
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Type: 2016 VS 2021 VS 2027
1.2.2 Chemical Debonding
1.2.3 Hot Sliding Debonding
1.2.4 Mechanical Debonding
1.2.5 Laser Debonding
1.3 Market by Application
1.3.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application: 2016 VS 2021 VS 2027
1.3.2 < 100 µm Wafers
1.3.3 below 40µm Wafers
1.4 Study Objectives
1.5 Years Considered
2 Global Growth Trends
2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Perspective (2016-2027)
2.2 Thin Wafers Temporary Bonding Equipment and Materials Growth Trends by Regions
2.2.1 Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions: 2016 VS 2021 VS 2027
2.2.2 Thin Wafers Temporary Bonding Equipment and Materials Historic Market Share by Regions (2016-2021)
2.2.3 Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Regions (2022-2027)
2.3 Thin Wafers Temporary Bonding Equipment and Materials Industry Dynamic
2.3.1 Thin Wafers Temporary Bonding Equipment and Materials Market Trends
2.3.2 Thin Wafers Temporary Bonding Equipment and Materials Market Drivers
2.3.3 Thin Wafers Temporary Bonding Equipment and Materials Market Challenges
2.3.4 Thin Wafers Temporary Bonding Equipment and Materials Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Revenue
3.1.1 Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Revenue (2016-2021)
3.1.2 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Players (2016-2021)
3.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
3.3 Players Covered: Ranking by Thin Wafers Temporary Bonding Equipment and Materials Revenue
3.4 Global Thin Wafers Temporary Bonding Equipment and Materials Market Concentration Ratio
3.4.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Thin Wafers Temporary Bonding Equipment and Materials Revenue in 2020
3.5 Thin Wafers Temporary Bonding Equipment and Materials Key Players Head office and Area Served
3.6 Key Players Thin Wafers Temporary Bonding Equipment and Materials Product Solution and Service
3.7 Date of Enter into Thin Wafers Temporary Bonding Equipment and Materials Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Thin Wafers Temporary Bonding Equipment and Materials Breakdown Data by Type
4.1 Global Thin Wafers Temporary Bonding Equipment and Materials Historic Market Size by Type (2016-2021)
4.2 Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Type (2022-2027)
5 Thin Wafers Temporary Bonding Equipment and Materials Breakdown Data by Application
5.1 Global Thin Wafers Temporary Bonding Equipment and Materials Historic Market Size by Application (2016-2021)
5.2 Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Application (2022-2027)
6 North America
6.1 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size (2016-2027)
6.2 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
6.2.1 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021)
6.2.2 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027)
6.2.3 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2027)
6.3 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
6.3.1 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021)
6.3.2 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027)
6.3.3 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2027)
6.4 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country
6.4.1 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021)
6.4.2 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027)
6.4.3 United States
6.4.3 Canada
7 Europe
7.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size (2016-2027)
7.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
7.2.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021)
7.2.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027)
7.2.3 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2027)
7.3 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
7.3.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021)
7.3.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027)
7.3.3 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2027)
7.4 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country
7.4.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021)
7.4.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic
8 Asia-Pacific
8.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size (2016-2027)
8.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
8.2.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021)
8.2.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027)
8.2.3 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2027)
8.3 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
8.3.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021)
8.3.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027)
8.3.3 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2027)
8.4 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region
8.4.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2016-2021)
8.4.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2022-2027)
8.4.3 China
8.4.4 Japan
8.4.5 South Korea
8.4.6 Southeast Asia
8.4.7 India
8.4.8 Australia
9 Latin America
9.1 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size (2016-2027)
9.2 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
9.2.1 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021)
9.2.2 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027)
9.2.3 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2027)
9.3 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
9.3.1 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021)
9.3.2 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027)
9.3.3 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2027)
9.4 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country
9.4.1 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021)
9.4.2 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027)
9.4.3 Mexico
9.4.4 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size (2016-2027)
10.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
10.2.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021)
10.2.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027)
10.2.3 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2027)
10.3 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
10.3.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021)
10.3.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027)
10.3.3 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2027)
10.4 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country
10.4.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021)
10.4.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027)
10.4.3 Turkey
10.4.4 Saudi Arabia
10.4.5 UAE
11 Key Players Profiles
11.1 3M
11.1.1 3M Company Details
11.1.2 3M Business Overview
11.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.1.4 3M Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.1.5 3M Recent Development
11.2 ABB
11.2.1 ABB Company Details
11.2.2 ABB Business Overview
11.2.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.2.4 ABB Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.2.5 ABB Recent Development
11.3 Accretech
11.3.1 Accretech Company Details
11.3.2 Accretech Business Overview
11.3.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.3.4 Accretech Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.3.5 Accretech Recent Development
11.4 AGC
11.4.1 AGC Company Details
11.4.2 AGC Business Overview
11.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.4.4 AGC Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.4.5 AGC Recent Development
11.5 AMD
11.5.1 AMD Company Details
11.5.2 AMD Business Overview
11.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.5.4 AMD Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.5.5 AMD Recent Development
11.6 Cabot
11.6.1 Cabot Company Details
11.6.2 Cabot Business Overview
11.6.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.6.4 Cabot Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.6.5 Cabot Recent Development
11.7 Corning
11.7.1 Corning Company Details
11.7.2 Corning Business Overview
11.7.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.7.4 Corning Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.7.5 Corning Recent Development
11.8 Crystal Solar
11.8.1 Crystal Solar Company Details
11.8.2 Crystal Solar Business Overview
11.8.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.8.4 Crystal Solar Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.8.5 Crystal Solar Recent Development
11.9 Dalsa
11.9.1 Dalsa Company Details
11.9.2 Dalsa Business Overview
11.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.9.4 Dalsa Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.9.5 Dalsa Recent Development
11.10 DoubleCheck Semiconductors
11.10.1 DoubleCheck Semiconductors Company Details
11.10.2 DoubleCheck Semiconductors Business Overview
11.10.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.10.4 DoubleCheck Semiconductors Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.10.5 DoubleCheck Semiconductors Recent Development
11.11 1366 Technologies
11.11.1 1366 Technologies Company Details
11.11.2 1366 Technologies Business Overview
11.11.3 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.11.4 1366 Technologies Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.11.5 1366 Technologies Recent Development
11.12 Ebara
11.12.1 Ebara Company Details
11.12.2 Ebara Business Overview
11.12.3 Ebara Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.12.4 Ebara Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.12.5 Ebara Recent Development
11.13 ERS
11.13.1 ERS Company Details
11.13.2 ERS Business Overview
11.13.3 ERS Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.13.4 ERS Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.13.5 ERS Recent Development
11.14 Hamamatsu
11.14.1 Hamamatsu Company Details
11.14.2 Hamamatsu Business Overview
11.14.3 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.14.4 Hamamatsu Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.14.5 Hamamatsu Recent Development
11.15 IBM
11.15.1 IBM Company Details
11.15.2 IBM Business Overview
11.15.3 IBM Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.15.4 IBM Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.15.5 IBM Recent Development
11.16 Intel
11.16.1 Intel Company Details
11.16.2 Intel Business Overview
11.16.3 Intel Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.16.4 Intel Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.16.5 Intel Recent Development
11.17 LG Innotek
11.17.1 LG Innotek Company Details
11.17.2 LG Innotek Business Overview
11.17.3 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.17.4 LG Innotek Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.17.5 LG Innotek Recent Development
11.18 Mitsubishi Electric
11.18.1 Mitsubishi Electric Company Details
11.18.2 Mitsubishi Electric Business Overview
11.18.3 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.18.4 Mitsubishi Electric Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.18.5 Mitsubishi Electric Recent Development
11.18 Qualcomm
.1 Qualcomm Company Details
.2 Qualcomm Business Overview
.3 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Introduction
.4 Qualcomm Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
.5 Qualcomm Recent Development
11.20 Robert Bosch
11.20.1 Robert Bosch Company Details
11.20.2 Robert Bosch Business Overview
11.20.3 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.20.4 Robert Bosch Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.20.5 Robert Bosch Recent Development
11.21 Samsung
11.21.1 Samsung Company Details
11.21.2 Samsung Business Overview
11.21.3 Samsung Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.21.4 Samsung Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.21.5 Samsung Recent Development
11.22 Sumitomo Chemical
11.22.1 Sumitomo Chemical Company Details
11.22.2 Sumitomo Chemical Business Overview
11.22.3 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.22.4 Sumitomo Chemical Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
11.22.5 Sumitomo Chemical Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Table 1. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Type (US$ Million):2016 VS 2021 VS 2027
Table 2. Key Players of Chemical Debonding
Table 3. Key Players of Hot Sliding Debonding
Table 4. Key Players of Mechanical Debonding
Table 5. Key Players of Laser Debonding
Table 6. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth by Application (US$ Million): 2016 VS 2021 VS 2027
Table 7. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions (US$ Million): 2016 VS 2021 VS 2027
Table 8. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions (2016-2021) & (US$ Million)
Table 9. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Regions (2016-2021)
Table 10. Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Regions (2022-2027) & (US$ Million)
Table 11. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Regions (2022-2027)
Table 12. Thin Wafers Temporary Bonding Equipment and Materials Market Trends
Table 13. Thin Wafers Temporary Bonding Equipment and Materials Market Drivers
Table 14. Thin Wafers Temporary Bonding Equipment and Materials Market Challenges
Table 15. Thin Wafers Temporary Bonding Equipment and Materials Market Restraints
Table 16. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Players (2016-2021) & (US$ Million)
Table 17. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Players (2016-2021)
Table 18. Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in Thin Wafers Temporary Bonding Equipment and Materials as of 2020)
Table 19. Ranking of Global Top Thin Wafers Temporary Bonding Equipment and Materials Companies by Revenue (US$ Million) in 2020
Table 20. Global 5 Largest Players Market Share by Thin Wafers Temporary Bonding Equipment and Materials Revenue (CR5 and HHI) & (2016-2021)
Table 21. Key Players Headquarters and Area Served
Table 22. Key Players Thin Wafers Temporary Bonding Equipment and Materials Product Solution and Service
Table 23. Date of Enter into Thin Wafers Temporary Bonding Equipment and Materials Market
Table 24. Mergers & Acquisitions, Expansion Plans
Table 25. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021) (US$ Million)
Table 26. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type (2016-2021)
Table 27. Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Type (2022-2027) (US$ Million)
Table 28. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type (2022-2027) & (US$ Million)
Table 29. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Share by Application (2016-2021) & (US$ Million)
Table 30. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Application (2016-2021)
Table 31. Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Application (2022-2027) (US$ Million)
Table 32. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Application (2022-2027) & (US$ Million)
Table 33. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021) (US$ Million)
Table 34. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027) & (US$ Million)
Table 35. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021) (US$ Million)
Table 36. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027) & (US$ Million)
Table 37. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021) & (US$ Million)
Table 38. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027) & (US$ Million)
Table 39. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021) (US$ Million)
Table 40. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027) & (US$ Million)
Table 41. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021) (US$ Million)
Table 42. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027) & (US$ Million)
Table 43. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021) & (US$ Million)
Table 44. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027) & (US$ Million)
Table 45. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021) (US$ Million)
Table 46. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027) & (US$ Million)
Table 47. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021) (US$ Million)
Table 48. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027) & (US$ Million)
Table 49. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2016-2021) & (US$ Million)
Table 50. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2022-2027) & (US$ Million)
Table 51. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021) (US$ Million)
Table 52. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027) & (US$ Million)
Table 53. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021) (US$ Million)
Table 54. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027) & (US$ Million)
Table 55. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021) & (US$ Million)
Table 56. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027) & (US$ Million)
Table 57. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2016-2021) (US$ Million)
Table 58. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2022-2027) & (US$ Million)
Table 59. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2016-2021) (US$ Million)
Table 60. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2022-2027) & (US$ Million)
Table 61. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2016-2021) & (US$ Million)
Table 62. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2022-2027) & (US$ Million)
Table 63. 3M Company Details
Table 64. 3M Business Overview
Table 65. 3M Thin Wafers Temporary Bonding Equipment and Materials Product
Table 66. 3M Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 67. 3M Recent Development
Table 68. ABB Company Details
Table 69. ABB Business Overview
Table 70. ABB Thin Wafers Temporary Bonding Equipment and Materials Product
Table 71. ABB Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 72. ABB Recent Development
Table 73. Accretech Company Details
Table 74. Accretech Business Overview
Table 75. Accretech Thin Wafers Temporary Bonding Equipment and Materials Product
Table 76. Accretech Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 77. Accretech Recent Development
Table 78. AGC Company Details
Table 79. AGC Business Overview
Table 80. AGC Thin Wafers Temporary Bonding Equipment and Materials Product
Table 81. AGC Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 82. AGC Recent Development
Table 83. AMD Company Details
Table 84. AMD Business Overview
Table 85. AMD Thin Wafers Temporary Bonding Equipment and Materials Product
Table 86. AMD Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 87. AMD Recent Development
Table 88. Cabot Company Details
Table 89. Cabot Business Overview
Table 90. Cabot Thin Wafers Temporary Bonding Equipment and Materials Product
Table 91. Cabot Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 92. Cabot Recent Development
Table 93. Corning Company Details
Table 94. Corning Business Overview
Table 95. Corning Thin Wafers Temporary Bonding Equipment and Materials Product
Table 96. Corning Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 97. Corning Recent Development
Table 98. Crystal Solar Company Details
Table 99. Crystal Solar Business Overview
Table 100. Crystal Solar Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 101. Crystal Solar Recent Development
Table 102. Dalsa Company Details
Table 103. Dalsa Business Overview
Table 104. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Product
Table 105. Dalsa Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 106. Dalsa Recent Development
Table 107. DoubleCheck Semiconductors Company Details
Table 108. DoubleCheck Semiconductors Business Overview
Table 109. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Product
Table 110. DoubleCheck Semiconductors Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 111. DoubleCheck Semiconductors Recent Development
Table 112. 1366 Technologies Company Details
Table 113. 1366 Technologies Business Overview
Table 114. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Product
Table 115. 1366 Technologies Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 116. 1366 Technologies Recent Development
Table 117. Ebara Company Details
Table 118. Ebara Business Overview
Table 119. Ebara Thin Wafers Temporary Bonding Equipment and Materials Product
Table 120. Ebara Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 121. Ebara Recent Development
Table 122. ERS Company Details
Table 123. ERS Business Overview
Table 124. ERS Thin Wafers Temporary Bonding Equipment and Materials Product
Table 125. ERS Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 126. ERS Recent Development
Table 127. Hamamatsu Company Details
Table 128. Hamamatsu Business Overview
Table 129. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Product
Table 130. Hamamatsu Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 131. Hamamatsu Recent Development
Table 132. IBM Company Details
Table 133. IBM Business Overview
Table 134. IBM Thin Wafers Temporary Bonding Equipment and Materials Product
Table 135. IBM Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 136. IBM Recent Development
Table 137. Intel Company Details
Table 138. Intel Business Overview
Table 139. Intel Thin Wafers Temporary Bonding Equipment and Materials Product
Table 140. Intel Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 141. Intel Recent Development
Table 142. LG Innotek Company Details
Table 143. LG Innotek Business Overview
Table 144. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Product
Table 145. LG Innotek Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 146. LG Innotek Recent Development
Table 147. Mitsubishi Electric Company Details
Table 148. Mitsubishi Electric Business Overview
Table 149. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Product
Table 150. Mitsubishi Electric Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 151. Mitsubishi Electric Recent Development
Table 152. Qualcomm Company Details
Table 153. Qualcomm Business Overview
Table 154. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Product
Table 155. Qualcomm Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 156. Qualcomm Recent Development
Table 157. Robert Bosch Company Details
Table 158. Robert Bosch Business Overview
Table 159. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Product
Table 160. Robert Bosch Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 161. Robert Bosch Recent Development
Table 162. Samsung Company Details
Table 163. Samsung Business Overview
Table 164. Samsung Thin Wafers Temporary Bonding Equipment and Materials Product
Table 165. Samsung Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 166. Samsung Recent Development
Table 167. Sumitomo Chemical Company Details
Table 168. Sumitomo Chemical Business Overview
Table 169. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Product
Table 170. Sumitomo Chemical Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021) & (US$ Million)
Table 171. Sumitomo Chemical Recent Development
Table 172. Research Programs/Design for This Report
Table 173. Key Data Information from Secondary Sources
Table 174. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Type: 2020 VS 2027
Figure 2. Chemical Debonding Features
Figure 3. Hot Sliding Debonding Features
Figure 4. Mechanical Debonding Features
Figure 5. Laser Debonding Features
Figure 6. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application: 2020 VS 2027
Figure 7. < 100 µm Wafers Case Studies
Figure 8. below 40µm Wafers Case Studies
Figure 9. Thin Wafers Temporary Bonding Equipment and Materials Report Years Considered
Figure 10. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size (US$ Million), Year-over-Year: 2016-2027
Figure 11. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size (US$ Million), 2016 VS 2021 VS 2027
Figure 12. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Regions: 2020 VS 2027
Figure 13. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Regions (2022-2027)
Figure 14. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Players in 2020
Figure 15. Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in Thin Wafers Temporary Bonding Equipment and Materials as of 2020
Figure 16. The Top 10 and 5 Players Market Share by Thin Wafers Temporary Bonding Equipment and Materials Revenue in 2020
Figure 17. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type (2016-2021)
Figure 18. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type (2022-2027)
Figure 19. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 20. North America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Type (2016-2027)
Figure 21. North America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application (2016-2027)
Figure 22. North America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2016-2027)
Figure 23. United States Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 24. Canada Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 25. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 26. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Share by Type (2016-2027)
Figure 27. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application (2016-2027)
Figure 28. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2016-2027)
Figure 29. Germany Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 30. France Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 31. U.K. Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 32. Italy Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 33. Russia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 34. Nordic Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 35. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 36. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Share by Type (2016-2027)
Figure 37. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application (2016-2027)
Figure 38. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Share by Region (2016-2027)
Figure 39. China Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 40. Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 41. South Korea Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 42. Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 43. India Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 44. Australia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 45. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 46. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Type (2016-2027)
Figure 47. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application (2016-2027)
Figure 48. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2016-2027)
Figure 49. Mexico Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 50. Brazil Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 51. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 52. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Share by Type (2016-2027)
Figure 53. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application (2016-2027)
Figure 54. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2016-2027)
Figure 55. Turkey Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 56. Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 57. UAE Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2016-2027) & (US$ Million)
Figure 58. 3M Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 59. ABB Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 60. Accretech Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 61. AGC Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 62. AMD Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 63. Cabot Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 64. Corning Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 65. Crystal Solar Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 66. Dalsa Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 67. DoubleCheck Semiconductors Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 68. 1366 Technologies Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 69. Ebara Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 70. ERS Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 71. Hamamatsu Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 72. IBM Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 73. Intel Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 74. LG Innotek Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 75. Mitsubishi Electric Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 76. Qualcomm Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 77. Robert Bosch Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 78. Samsung Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 79. Sumitomo Chemical Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2016-2021)
Figure 80. Bottom-up and Top-down Approaches for This Report
Figure 81. Data Triangulation
Figure 82. Key Executives Interviewed
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