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レポート概要
| 当調査資料では、3DIC＆2.5DICパッケージングのグローバル市場について調査・分析し、2021年から2026年までの市場予測をまとめております。3DIC＆2.5DICパッケージングの種類別市場規模（3D TSV、2.5D・3Dウェーハレベルチップスケールパッケージング（WLCSP））、用途別市場規模（自動車、家電、医療機器、軍事・航空宇宙、通信、工業用・スマートテクノロジー）、地域別市場規模（北米、アメリカ、ヨーロッパ、アジア、中国、日本、東南アジア、南米、中東、アフリカなど）、市場動向、企業別販売量と市場シェア、販売チャネルなどの情報を掲載しています。 ・3DIC＆2.5DICパッケージングの市場概要 ・企業情報（企業概要、製品概要、販売量、価格、売上）：Valeo、Continental、Magna International、Hitachi Automotive、Fujitsu、Ficosa ・企業別市場シェア ・地域別市場分析2016年-2026年 ・種類別分析2016年-2026年：3D TSV、2.5D・3Dウェーハレベルチップスケールパッケージング（WLCSP） ・用途別分析2016年-2026年：自動車、家電、医療機器、軍事・航空宇宙、通信、工業用・スマートテクノロジー ・3DIC＆2.5DICパッケージングの北米市場規模2016年-2026年：アメリカ、カナダ、メキシコ ・3DIC＆2.5DICパッケージングのヨーロッパ市場規模2016年-2026年：ドイツ、イギリス、フランス、ロシア、イタリア ・3DIC＆2.5DICパッケージングのアジア市場規模2016年-2026年：中国、日本、韓国、インド、東南アジア、オーストラリア ・3DIC＆2.5DICパッケージングの南米市場規模2016年-2026年：ブラジル、アルゼンチン ・3DIC＆2.5DICパッケージングの中東・アフリカ市場規模2016年-2026年：サウジアラビア、トルコ、エジプト、南アフリカ ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
The 3D IC & 2.5D IC Packaging market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our latest research, the global 3D IC & 2.5D IC Packaging size is estimated to be xx million in 2020 from USD xx million in 2019, with a change of XX% between 2019 and 2020. The global 3D IC & 2.5D IC Packaging market size is expected to grow at a CAGR of xx% for the next five years.
Market segmentation
3D IC & 2.5D IC Packaging market is split by Type and by Application. For the period 2016-2026, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Market segment by Application can be divided into
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies
The key market players for global 3D IC & 2.5D IC Packaging market are listed below:
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering
Market segment by Region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
1 Market Overview
1.1 3D IC & 2.5D IC Packaging Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global 3D IC & 2.5D IC Packaging Revenue by Type: 2019 Versus 2021 Versus 2026
1.2.2 3D TSV
1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
1.3 Market Analysis by Application
1.3.1 Overview: Global 3D IC & 2.5D IC Packaging Revenue by Application: 2019 Versus 2021 Versus 2026
1.3.2 Automotive
1.3.3 Consumer electronics
1.3.4 Medical devices
1.3.5 Military & aerospace
1.3.6 Telecommunication
1.3.7 Industrial sector and smart technologies
1.4 Global 3D IC & 2.5D IC Packaging Market Size & Forecast
1.4.1 Global 3D IC & 2.5D IC Packaging Sales in Value (2016-2026))
1.4.2 Global 3D IC & 2.5D IC Packaging Sales in Volume (2016-2026)
1.4.3 Global 3D IC & 2.5D IC Packaging Price by Type (2016-2026) & (USD/Unit)
1.5 Global 3D IC & 2.5D IC Packaging Production Capacity Analysis
1.5.1 Global 3D IC & 2.5D IC Packaging Total Production Capacity (2016-2026)
1.5.2 Global 3D IC & 2.5D IC Packaging Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 3D IC & 2.5D IC Packaging Market Drivers
1.6.2 3D IC & 2.5D IC Packaging Market Restraints
1.6.3 3D IC & 2.5D IC Packaging Trends Analysis
2 Manufacturers Profiles
2.1 Intel Corporation
2.1.1 Intel Corporation Details
2.1.2 Intel Corporation Major Business
2.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Product and Services
2.1.4 Intel Corporation 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.2 Toshiba Corp
2.2.1 Toshiba Corp Details
2.2.2 Toshiba Corp Major Business
2.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Product and Services
2.2.4 Toshiba Corp 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.3 Samsung Electronics
2.3.1 Samsung Electronics Details
2.3.2 Samsung Electronics Major Business
2.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Product and Services
2.3.4 Samsung Electronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.4 Stmicroelectronics
2.4.1 Stmicroelectronics Details
2.4.2 Stmicroelectronics Major Business
2.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Product and Services
2.4.4 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.5 Taiwan Semiconductor Manufacturing
2.5.1 Taiwan Semiconductor Manufacturing Details
2.5.2 Taiwan Semiconductor Manufacturing Major Business
2.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product and Services
2.5.4 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.6 Amkor Technology
2.6.1 Amkor Technology Details
2.6.2 Amkor Technology Major Business
2.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Product and Services
2.6.4 Amkor Technology 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.7 United Microelectronics
2.7.1 United Microelectronics Details
2.7.2 United Microelectronics Major Business
2.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Product and Services
2.7.4 United Microelectronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.8 Broadcom
2.8.1 Broadcom Details
2.8.2 Broadcom Major Business
2.8.3 Broadcom 3D IC & 2.5D IC Packaging Product and Services
2.8.4 Broadcom 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.9 ASE Group
2.9.1 ASE Group Details
2.9.2 ASE Group Major Business
2.9.3 ASE Group 3D IC & 2.5D IC Packaging Product and Services
2.9.4 ASE Group 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.10 Pure Storage
2.10.1 Pure Storage Details
2.10.2 Pure Storage Major Business
2.10.3 Pure Storage 3D IC & 2.5D IC Packaging Product and Services
2.10.4 Pure Storage 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
2.11 Advanced Semiconductor Engineering
2.11.1 Advanced Semiconductor Engineering Details
2.11.2 Advanced Semiconductor Engineering Major Business
2.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product and Services
2.11.4 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019-2021e)
3 3D IC & 2.5D IC Packaging Sales by Manufacturer
3.1 Global 3D IC & 2.5D IC Packaging Sales in Volume by Manufacturer (2019-2021e)
3.2 Global 3D IC & 2.5D IC Packaging Revenue by Manufacturer (2019-2021e)
3.3 Key Manufacturer Market Position in 3D IC & 2.5D IC Packaging
3.4 Market Concentration Rate
3.4.1 Top 3 3D IC & 2.5D IC Packaging Manufacturer Market Share
3.4.2 Top 6 3D IC & 2.5D IC Packaging Manufacturer Market Share
3.5 Global 3D IC & 2.5D IC Packaging Production Capacity by Company
3.6 Manufacturer by Geography: Head Office and 3D IC & 2.5D IC Packaging Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global 3D IC & 2.5D IC Packaging Market Size by Region
4.1.1 Global 3D IC & 2.5D IC Packaging Sales in Volume by Region (2016-2026)
4.1.2 Global 3D IC & 2.5D IC Packaging Revenue by Region (2016-2026)
4.2 North America 3D IC & 2.5D IC Packaging Revenue (2016-2026)
4.3 Europe 3D IC & 2.5D IC Packaging Revenue (2016-2026)
4.4 Asia-Pacific 3D IC & 2.5D IC Packaging Revenue (2016-2026)
4.5 South America 3D IC & 2.5D IC Packaging Revenue (2016-2026)
4.6 Middle East and Africa 3D IC & 2.5D IC Packaging Revenue (2016-2026)
5 Market Segment by Type
5.1 Global 3D IC & 2.5D IC Packaging Sales in Volume by Type (2016-2026)
5.2 Global 3D IC & 2.5D IC Packaging Revenue by Type (2016-2026)
5.3 Global 3D IC & 2.5D IC Packaging Price by Type (2016-2026)
6 Market Segment by Application
6.1 Global 3D IC & 2.5D IC Packaging Sales in Volume by Application (2016-2026)
6.2 Global 3D IC & 2.5D IC Packaging Revenue by Application (2016-2026)
6.3 Global 3D IC & 2.5D IC Packaging Price by Application (2016-2026)
7 North America by Country, by Type, and by Application
7.1 North America 3D IC & 2.5D IC Packaging Sales by Type (2016-2026)
7.2 North America 3D IC & 2.5D IC Packaging Sales by Application (2016-2026)
7.3 North America 3D IC & 2.5D IC Packaging Market Size by Country
7.3.1 North America 3D IC & 2.5D IC Packaging Sales in Volume by Country (2016-2026)
7.3.2 North America 3D IC & 2.5D IC Packaging Revenue by Country (2016-2026)
7.3.3 United States Market Size and Forecast (2016-2026)
7.3.4 Canada Market Size and Forecast (2016-2026)
7.3.5 Mexico Market Size and Forecast (2016-2026)
8 Europe by Country, by Type, and by Application
8.1 Europe 3D IC & 2.5D IC Packaging Sales by Type (2016-2026)
8.2 Europe 3D IC & 2.5D IC Packaging Sales by Application (2016-2026)
8.3 Europe 3D IC & 2.5D IC Packaging Market Size by Country
8.3.1 Europe 3D IC & 2.5D IC Packaging Sales in Volume by Country (2016-2026)
8.3.2 Europe 3D IC & 2.5D IC Packaging Revenue by Country (2016-2026)
8.3.3 Germany Market Size and Forecast (2016-2026)
8.3.4 France Market Size and Forecast (2016-2026)
8.3.5 United Kingdom Market Size and Forecast (2016-2026)
8.3.6 Russia Market Size and Forecast (2016-2026)
8.3.7 Italy Market Size and Forecast (2016-2026)
9 Asia-Pacific by Country, by Type, and by Application
9.1 Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Type (2016-2026)
9.2 Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Application (2016-2026)
9.3 Asia-Pacific 3D IC & 2.5D IC Packaging Market Size by Region
9.3.1 Asia-Pacific 3D IC & 2.5D IC Packaging Sales in Volume by Region (2016-2026)
9.3.2 Asia-Pacific 3D IC & 2.5D IC Packaging Revenue by Region (2016-2026)
9.3.3 China Market Size and Forecast (2016-2026)
9.3.4 Japan Market Size and Forecast (2016-2026)
9.3.5 Korea Market Size and Forecast (2016-2026)
9.3.6 India Market Size and Forecast (2016-2026)
9.3.7 Southeast Asia Market Size and Forecast (2016-2026)
9.3.8 Australia Market Size and Forecast (2016-2026)
10 South America by Country, by Type, and by Application
10.1 South America 3D IC & 2.5D IC Packaging Sales by Type (2016-2026)
10.2 South America 3D IC & 2.5D IC Packaging Sales by Application (2016-2026)
10.3 South America 3D IC & 2.5D IC Packaging Market Size by Country
10.3.1 South America 3D IC & 2.5D IC Packaging Sales in Volume by Country (2016-2026)
10.3.2 South America 3D IC & 2.5D IC Packaging Revenue by Country (2016-2026)
10.3.3 Brazil Market Size and Forecast (2016-2026)
10.3.4 Argentina Market Size and Forecast (2016-2026)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Type (2016-2026)
11.2 Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Application (2016-2026)
11.3 Middle East & Africa 3D IC & 2.5D IC Packaging Market Size by Country
11.3.1 Middle East & Africa 3D IC & 2.5D IC Packaging Sales in Volume by Country (2016-2026)
11.3.2 Middle East & Africa 3D IC & 2.5D IC Packaging Revenue by Country (2016-2026)
11.3.3 Turkey Market Size and Forecast (2016-2026)
11.3.4 Egypt Market Size and Forecast (2016-2026)
11.3.5 Saudi Arabia Market Size and Forecast (2016-2026)
11.3.6 South Africa Market Size and Forecast (2016-2026)
12 Sales Channel, Distributors, Traders and Dealers
12.1 Sales Channel
12.1.1 Direct Marketing
12.1.2 Indirect Marketing
12.2 3D IC & 2.5D IC Packaging Typical Distributors
12.3 3D IC & 2.5D IC Packaging Typical Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
Table 1. Global 3D IC & 2.5D IC Packaging Revenue by Type, (USD Million), 2021-2026
Table 2. Global 3D IC & 2.5D IC Packaging Revenue by Application, (USD Million), 2021-2026
Table 3. Intel Corporation Basic Information, Manufacturing Base and Competitors
Table 4. Intel Corporation Major Business
Table 5. Intel Corporation 3D IC & 2.5D IC Packaging Product and Services
Table 6. Intel Corporation 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 7. Toshiba Corp Basic Information, Manufacturing Base and Competitors
Table 8. Toshiba Corp Major Business
Table 9. Toshiba Corp 3D IC & 2.5D IC Packaging Product and Services
Table 10. Toshiba Corp 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 11. Samsung Electronics Basic Information, Manufacturing Base and Competitors
Table 12. Samsung Electronics Major Business
Table 13. Samsung Electronics 3D IC & 2.5D IC Packaging Product and Services
Table 14. Samsung Electronics 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 15. Stmicroelectronics Basic Information, Manufacturing Base and Competitors
Table 16. Stmicroelectronics Major Business
Table 17. Stmicroelectronics 3D IC & 2.5D IC Packaging Product and Services
Table 18. Stmicroelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 19. Taiwan Semiconductor Manufacturing Basic Information, Manufacturing Base and Competitors
Table 20. Taiwan Semiconductor Manufacturing Major Business
Table 21. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product and Services
Table 22. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 23. Amkor Technology Basic Information, Manufacturing Base and Competitors
Table 24. Amkor Technology Major Business
Table 25. Amkor Technology 3D IC & 2.5D IC Packaging Product and Services
Table 26. Amkor Technology 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 27. United Microelectronics Basic Information, Manufacturing Base and Competitors
Table 28. United Microelectronics Major Business
Table 29. United Microelectronics 3D IC & 2.5D IC Packaging Product and Services
Table 30. United Microelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 31. Broadcom Basic Information, Manufacturing Base and Competitors
Table 32. Broadcom Major Business
Table 33. Broadcom 3D IC & 2.5D IC Packaging Product and Services
Table 34. Broadcom 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 35. ASE Group Basic Information, Manufacturing Base and Competitors
Table 36. ASE Group Major Business
Table 37. ASE Group 3D IC & 2.5D IC Packaging Product and Services
Table 38. ASE Group 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 39. Pure Storage Basic Information, Manufacturing Base and Competitors
Table 40. Pure Storage Major Business
Table 41. Pure Storage 3D IC & 2.5D IC Packaging Product and Services
Table 42. Pure Storage 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 43. Advanced Semiconductor Engineering Basic Information, Manufacturing Base and Competitors
Table 44. Advanced Semiconductor Engineering Major Business
Table 45. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product and Services
Table 46. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales (K Units), Price (USD/Unit), Revenue (USD Million), Gross Margin and Market Share (2019-2021e)
Table 47. Global 3D IC & 2.5D IC Packaging Sales by Manufacturer (2019-2021e) & (K Units)
Table 48. Global 3D IC & 2.5D IC Packaging Revenue by Manufacturer (2019-2021e) & (USD Million)
Table 49. Market Position of Manufacturers in 3D IC & 2.5D IC Packaging, (Tier 1, Tier 2, and Tier 3), Based on Revenue in 2020
Table 50. Global 3D IC & 2.5D IC Packaging Production Capacity by Company, (K Units): 2020 VS 2021
Table 51. Head Office and 3D IC & 2.5D IC Packaging Production Site of Key Manufacturer
Table 52. Global 3D IC & 2.5D IC Packaging Sales by Region (2016-2021e) & (K Units)
Table 53. Global 3D IC & 2.5D IC Packaging Sales by Region (2021-2026) & (K Units)
Table 54. Global 3D IC & 2.5D IC Packaging Revenue by Region (2016-2021e) & (USD Million)
Table 55. Global 3D IC & 2.5D IC Packaging Revenue by Region (2021-2026) & (USD Million)
Table 56. Global 3D IC & 2.5D IC Packaging Sales by Type (2016-2021e) & (K Units)
Table 57. Global 3D IC & 2.5D IC Packaging Sales by Type (2021-2026) & (K Units)
Table 58. Global 3D IC & 2.5D IC Packaging Revenue by Type (2016-2021e) & (USD Million)
Table 59. Global 3D IC & 2.5D IC Packaging Revenue by Type (2021-2026) & (USD Million)
Table 60. Global 3D IC & 2.5D IC Packaging Price by Type (2016-2021e) & (USD/Unit)
Table 61. Global 3D IC & 2.5D IC Packaging Price by Type (2021-2026) & (USD/Unit)
Table 62. Global 3D IC & 2.5D IC Packaging Sales by Application (2016-2021e) & (K Units)
Table 63. Global 3D IC & 2.5D IC Packaging Sales by Application (2021-2026) & (K Units)
Table 64. Global 3D IC & 2.5D IC Packaging Revenue by Application (2016-2021e) & (USD Million)
Table 65. Global 3D IC & 2.5D IC Packaging Revenue by Application (2021-2026) & (USD Million)
Table 66. Global 3D IC & 2.5D IC Packaging Price by Application (2016-2021e) & (USD/Unit)
Table 67. Global 3D IC & 2.5D IC Packaging Price by Application (2021-2026) & (USD/Unit)
Table 68. North America 3D IC & 2.5D IC Packaging Sales by Country (2016-2021e) & (K Units)
Table 69. North America 3D IC & 2.5D IC Packaging Sales by Country (2021-2026) & (K Units)
Table 70. North America 3D IC & 2.5D IC Packaging Revenue by Country (2016-2021e) & (USD Million)
Table 71. North America 3D IC & 2.5D IC Packaging Revenue by Country (2021-2026) & (USD Million)
Table 72. North America 3D IC & 2.5D IC Packaging Sales by Type (2016-2021e) & (K Units)
Table 73. North America 3D IC & 2.5D IC Packaging Sales by Type (2021-2026) & (K Units)
Table 74. North America 3D IC & 2.5D IC Packaging Sales by Application (2016-2021e) & (K Units)
Table 75. North America 3D IC & 2.5D IC Packaging Sales by Application (2021-2026) & (K Units)
Table 76. Europe 3D IC & 2.5D IC Packaging Sales by Country (2016-2021e) & (K Units)
Table 77. Europe 3D IC & 2.5D IC Packaging Sales by Country (2021-2026) & (K Units)
Table 78. Europe 3D IC & 2.5D IC Packaging Revenue by Country (2016-2021e) & (USD Million)
Table 79. Europe 3D IC & 2.5D IC Packaging Revenue by Country (2021-2026) & (USD Million)
Table 80. Europe 3D IC & 2.5D IC Packaging Sales by Type (2016-2021e) & (K Units)
Table 81. Europe 3D IC & 2.5D IC Packaging Sales by Type (2021-2026) & (K Units)
Table 82. Europe 3D IC & 2.5D IC Packaging Sales by Application (2016-2021e) & (K Units)
Table 83. Europe 3D IC & 2.5D IC Packaging Sales by Application (2021-2026) & (K Units)
Table 84. Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Region (2016-2021e) & (K Units)
Table 85. Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Region (2021-2026) & (K Units)
Table 86. Asia-Pacific 3D IC & 2.5D IC Packaging Revenue by Region (2016-2021e) & (USD Million)
Table 87. Asia-Pacific 3D IC & 2.5D IC Packaging Revenue by Region (2021-2026) & (USD Million)
Table 88. Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Type (2016-2021e) & (K Units)
Table 89. Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Type (2021-2026) & (K Units)
Table 90. Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Application (2016-2021e) & (K Units)
Table 91. Asia-Pacific 3D IC & 2.5D IC Packaging Sales by Application (2021-2026) & (K Units)
Table 92. South America 3D IC & 2.5D IC Packaging Sales by Country (2016-2021e) & (K Units)
Table 93. South America 3D IC & 2.5D IC Packaging Sales by Country (2021-2026) & (K Units)
Table 94. South America 3D IC & 2.5D IC Packaging Revenue by Country (2016-2021e) & (USD Million)
Table 95. South America 3D IC & 2.5D IC Packaging Revenue by Country (2021-2026) & (USD Million)
Table 96. South America 3D IC & 2.5D IC Packaging Sales by Type (2016-2021e) & (K Units)
Table 97. South America 3D IC & 2.5D IC Packaging Sales by Type (2021-2026) & (K Units)
Table 98. South America 3D IC & 2.5D IC Packaging Sales by Application (2016-2021e) & (K Units)
Table 99. South America 3D IC & 2.5D IC Packaging Sales by Application (2021-2026) & (K Units)
Table 100. Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Country (2016-2021e) & (K Units)
Table 101. Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Country (2021-2026) & (K Units)
Table 102. Middle East & Africa 3D IC & 2.5D IC Packaging Revenue by Country (2016-2021e) & (USD Million)
Table 103. Middle East & Africa 3D IC & 2.5D IC Packaging Revenue by Country (2021-2026) & (USD Million)
Table 104. Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Type (2016-2021e) & (K Units)
Table 105. Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Type (2021-2026) & (K Units)
Table 106. Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Application (2016-2021e) & (K Units)
Table 107. Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Application (2021-2026) & (K Units)
Table 108. Direct Channel Pros & Cons
Table 109. Indirect Channel Pros & Cons
Table 110. 3D IC & 2.5D IC Packaging Typical Distributors
Table 111. 3D IC & 2.5D IC Packaging Typical Customers
List of Figures
Figure 1. 3D IC & 2.5D IC Packaging Picture
Figure 2. Global 3D IC & 2.5D IC Packaging Sales Market Share by Type in 2020
Figure 3. 3D TSV
Figure 4. 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Figure 5. Global 3D IC & 2.5D IC Packaging Sales Market Share by Application in 2020
Figure 6. Automotive
Figure 7. Consumer electronics
Figure 8. Medical devices
Figure 9. Military & aerospace
Figure 10. Telecommunication
Figure 11. Industrial sector and smart technologies
Figure 12. Global 3D IC & 2.5D IC Packaging Market Size, (USD Million) & (K Units): 2020 VS 2021 VS 2026
Figure 13. Global 3D IC & 2.5D IC Packaging Market Size and Forecast (2016-2026) & (USD Million)
Figure 14. United States 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 15. Canada 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 16. Mexico 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 17. Germany 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 18. France 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 19. United Kingdom 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 20. Russia 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 21. Italy 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 22. China 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 23. Japan 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 24. Korea 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 25. India 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 26. Southeast Asia 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 27. Australia 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 28. Brazil 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 29. Egypt 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 30. Saudi Arabia 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 31. South Africa 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 32. Turkey 3D IC & 2.5D IC Packaging Revenue and Growth Rate (2016-2026) & (USD Million)
Figure 33. Global 3D IC & 2.5D IC Packaging Sales (2016-2026) & (K Units)
Figure 34. Global 3D IC & 2.5D IC Packaging Production Capacity (2016-2026) & (K Units)
Figure 35. Global 3D IC & 2.5D IC Packaging Production Capacity by Geographic Region: 2020 VS 2021
Figure 36. 3D IC & 2.5D IC Packaging Market Drivers
Figure 37. 3D IC & 2.5D IC Packaging Market Restraints
Figure 38. 3D IC & 2.5D IC Packaging Market Trends
Figure 39. Global 3D IC & 2.5D IC Packaging Sales Market Share by Manufacturer in 2020
Figure 40. Global 3D IC & 2.5D IC Packaging Revenue Market Share by Manufacturer in 2020
Figure 41. 3D IC & 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
Figure 42. Top 3 3D IC & 2.5D IC Packaging Manufacturer (Revenue) Market Share in 2020
Figure 43. Top 6 3D IC & 2.5D IC Packaging Manufacturer (Revenue) Market Share in 2020
Figure 44. Global 3D IC & 2.5D IC Packaging Sales Market Share by Region (2016-2026)
Figure 45. Global 3D IC & 2.5D IC Packaging Revenue Market Share by Region (2016-2026)
Figure 46. North America 3D IC & 2.5D IC Packaging Revenue (2016-2026) & (USD Million)
Figure 47. Europe 3D IC & 2.5D IC Packaging Revenue (2016-2026) & (USD Million)
Figure 48. Asia-Pacific 3D IC & 2.5D IC Packaging Revenue (2016-2026) & (USD Million)
Figure 49. South America 3D IC & 2.5D IC Packaging Revenue (2016-2026) & (USD Million)
Figure 50. Middle East & Africa 3D IC & 2.5D IC Packaging Revenue (2016-2026) & (USD Million)
Figure 51. Global 3D IC & 2.5D IC Packaging Sales Market Share by Type (2016-2026)
Figure 52. Global 3D IC & 2.5D IC Packaging Revenue Market Share by Type (2016-2026)
Figure 53. Global 3D IC & 2.5D IC Packaging Price by Type (2016-2026) & (USD/Unit)
Figure 54. Global 3D IC & 2.5D IC Packaging Sales Market Share by Application (2016-2026)
Figure 55. Global 3D IC & 2.5D IC Packaging Revenue Market Share by Application (2016-2026)
Figure 56. Global 3D IC & 2.5D IC Packaging Price by Application (2016-2026) & (USD/Unit)
Figure 57. North America 3D IC & 2.5D IC Packaging Sales Market Share by Country (2016-2026)
Figure 58. North America 3D IC & 2.5D IC Packaging Revenue Market Share by Country (2016-2026)
Figure 59. North America 3D IC & 2.5D IC Packaging Sales Market Share by Type (2016-2026)
Figure 60. North America 3D IC & 2.5D IC Packaging Sales Market Share by Application (2016-2026)
Figure 61. Europe 3D IC & 2.5D IC Packaging Sales Market Share by Country (2016-2026)
Figure 62. Europe 3D IC & 2.5D IC Packaging Revenue Market Share by Country (2016-2026)
Figure 63. Europe 3D IC & 2.5D IC Packaging Sales Market Share by Type (2016-2026)
Figure 64. Europe 3D IC & 2.5D IC Packaging Sales Market Share by Application (2016-2026)
Figure 65. Asia-Pacific 3D IC & 2.5D IC Packaging Sales Market Share by Region (2016-2026)
Figure 66. Asia-Pacific 3D IC & 2.5D IC Packaging Revenue Market Share by Region (2016-2026)
Figure 67. Asia-Pacific 3D IC & 2.5D IC Packaging Sales Market Share by Region (2016-2026)
Figure 68. Asia-Pacific 3D IC & 2.5D IC Packaging Sales Market Share by Application (2016-2026)
Figure 69. South America 3D IC & 2.5D IC Packaging Sales Market Share by Country (2016-2026)
Figure 70. South America 3D IC & 2.5D IC Packaging Revenue Market Share by Country (2016-2026)
Figure 71. South America 3D IC & 2.5D IC Packaging Sales Market Share by Type (2016-2026)
Figure 72. South America 3D IC & 2.5D IC Packaging Sales Market Share by Application (2016-2026)
Figure 73. Middle East & Africa 3D IC & 2.5D IC Packaging Sales Market Share by Country (2016-2026)
Figure 74. Middle East & Africa 3D IC & 2.5D IC Packaging Revenue Market Share by Country (2016-2026)
Figure 75. Middle East & Africa 3D IC & 2.5D IC Packaging Sales Market Share by Type (2016-2026)
Figure 76. Middle East & Africa 3D IC & 2.5D IC Packaging Sales Market Share by Application (2016-2026)
Figure 77. Sales Channel: Direct Channel vs Indirect Channel
Figure 78. Methodology
Figure 79. Research Process and Data Source
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